What is HPC colocation?
HPC colocation hosts intensive compute workloads in infrastructure designed for power, thermal control, networking, monitoring and operational continuity.
HPC colocation: why immersion cooling becomes an advantage for intensive computing
HPC colocation requires continuous thermal density, reliable networking, controlled power and more transparent operations than traditional colocation.
VOLTANEUM connects 10U, 20U or 37U capacity, energy, network, servers and DCIM portal.
VOLTANEUM key facts
- Published immersion colocation capacities: 10U, 20U and 37U.
- Target density up to 200 kW+ per tank depending on integration and electrical constraints.
- 1.03 target PUE for optimized high-density architectures.
- Immersion cooling billed at €0.07/kW, electricity excluding cooling metered separately.
- VOLTANEUM® proprietary dielectric fluid and France / Europe operations.
What the customer actually gets
HPC colocation with immersion cooling addresses compute workloads that cannot tolerate thermal uncertainty: GPU clusters, simulation, inference, fine-tuning, intensive CPU workloads and scientific or industrial infrastructure.
The page must explain that customers buy usable capacity, not only space: reserved power, cooling, consumed energy, network, OS, remote management access, delivered servers and DCIM monitoring.
VOLTANEUM offers and capacity
- Detailed offers should specify capacity, reserved power, cooling, metered electricity, setup, stock conditions and immersion-ready validation.
Key benefits
VOLTANEUM® combines immersion cooling, proprietary dielectric fluid, GPU density up to 200 kW+ per tank, tenant isolation, 1.03 target PUE, DCIM automation, 2D/3D monitoring and request/payment/provisioning workflows.
The VOLTANEUM® proprietary dielectric liquid provides non-conductive electrical insulation, stronger thermal stability, reduced exposure to dust, oxidation and vibration, and more predictable maintenance through fluid, filtration, acidity, moisture and dielectric strength monitoring.
The -40°C to 250°C range is indicated on VOLTANEUM® packaging. Quality control on the tested batch reports a -37°C pour point, a 196°C open flash point and observed dielectric breakdown voltage of 52 kV.
- Electrical insulation for compatible immersion-ready equipment.
- Direct heat transfer close to GPU, HPC and bare metal components.
- Operational protection against dust, vibration and thermal stress.
- Quality controls can cover fluid temperature, acidity, moisture, filtration and dielectric strength.
The VOLTANEUM® white paper download is available after entering a business email in the public page form.
Related pages
Frequently asked questions
Why is immersion cooling useful for HPC?
HPC and GPU workloads concentrate heat. Immersion cooling reduces airflow constraints, stabilizes temperature and enables higher density.
What should an HPC customer verify?
Reserved power, cooling cost, metered electricity, network, remote management access, OS, server stock, SLA, maintenance and DCIM visibility.
Does VOLTANEUM support customer-owned servers?
Yes, through BYOH subject to immersion-ready validation, or through ITNET server orders depending on stock and available datacenter.